Web20 mag 2024 · Additionally, IRDL, one of RDL technologies, was named so as the entire process takes place inside a FAB, unlike PKG RDL. The figures below show the two MCP 1 methods for chips. “Vertical-Stack MCP” (left) is the existing technique where upper chips stack vertically on the lower chips’ bonding pad. “Shift-Stack MCP using RDL,” (right ... Web29 nov 2024 · The text was updated successfully, but these errors were encountered:
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